Warpage Reduction in Molded Interconnect Substrate Package through Pre-mold Material Modeling

Molded interconnect substrate (MIS) is a packaging technology that uses a pre-mold material as illustrated in Fig. 1.  The pre-mold materials have more compatible properties with silicon and package encapsulation material.  MIS is an alternative to organic laminate substrate or leadframe and a semiconductor package using it is shown in Fig. 2.  Package assembly using MIS is usually done in strip format, in which the die is attached to the MIS followed by wire bonding and then the whole strip is encapsulated using epoxy molding compound (EMC).