Modeling Investigation on the Relationship between Solder Joint Reliability and Die-to-Package Ratio
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 114-116
Keywords : ;
Abstract
With the requirement to increase semiconductor package functionality, larger die is being forced to fit in a smaller package footprint and this results in higher die-to-package ratio. Fig. 1 shows a QFN (quad flat no lead) package mounted on PCB or printed circuit board.
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Last modified: 2020-06-14 20:58:15