Adhesive Contamination Removal through Improvement at Package Sawing Process

Package sawing process in semiconductor assembly manufacturing is a process typically performed to separate integrated circuit packages such as IC chips from a substrate / leadframe in order to form the individual units.  In the absence of Jig sawing process, Tape sawing is being used due to its process capability limitation. Molded package is being mount unto the UV tape for stiffness and stability during package singulation.  Visual Mechanical Inspection must be free from any mechanical induce defect including any foreign materials and contaminants which will affect production cycle time due to its non-value added activity