Die Attach Pick-up Tool Design Studies for DAF Voids Elimination

As consumers market continue to push electronics manufacturers for smaller yet higher functioning products, packaging engineers must keep pace with the development of devices that can meet these demands. The main drivers for Die attach film (DAF) implementation are package miniaturization and die thickness reduction, especially in applications requiring thin die thickness. However, processing of DAF materials presents certain difficulties, especially in Die Attach Voids issue. This article tells the challenges in terms of die attach tooling and processing optimization to incorporate DAF into the assembly of a thin die in Ball Grid Array (BGA) package. Die Attach Pick-up tool characterization with material modification was conducted to provide insights on influence of the design of Pick-up tool on DAF voids. To achieve void-free lamination, it was found that Pick-up tool with distributed vacuum hole design to avoid die bending