ANALYSIS OF MICROCHANNEL HEAT SINK USING CFD

Investigations have been done to better understand the fluid flow and heat transfer in copper - based microchannel heat sinks designed for applications in electronics cooling. The present work addresses electronic chips cooling with force convection of alumina - water in copper based single microchannel heat sink by CFD software FLUENT. The Nusselt number variation along the flow direction is presented and compared for three different flow rates. The convection heat transfer coefficient also presented for above three cases. The laminar flow is considered during simulation along with energy equation. The different pressure drops are taken into consideration during simulation. The maximum pressure di fference can be taken for more flux condition imposed on the boundary and also to suppress the rise of temperature of microchannel heat sink. The temperature rise of the heat sink for 10kPa,20kPa,35kPa,50kPa and 65kPa are found to 398.7K,342.5K,321.6K,313. 9K and 308.5K respectively for copper microchannel heat sink when the heat flux is in the order of 9 × 10 5 W/m 2 .