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Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for Cooling in CPU

Journal: International Journal of Mechanical and Production Engineering Research and Development (IJMPERD ) (Vol.9, No. 2)

Publication Date:

Authors : ; ;

Page : 865-870

Keywords : Base Plate; Cooling Fan; CFD Simulation; Heat Sink; Heat Dissipation; IC’s; Fin Configuration & Thermocouples;

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A heat sink device, for use with specific power input at 100V and 20W to the heater, attached at the base plate of copper, and then obtained the average temperature of Heat sink with the help of 12 thermocouples. Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient with base of 1mm&2mm&tip dimensions varying as 0.5mm, 1.00mm, respectively. By experimenting and CFD simulations, optimization of heat sink design was done. Then, correlation and validation were to be adopted.

Last modified: 2019-06-14 21:19:26