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Process and Design Optimization of Electronic Package with Complex Stacked Dice Configuration
Journal: International Journal of Scientific Engineering and Science (Vol.3, No. 9)Publication Date: 2019-15-10
Authors : Rennier S. Rodriguez Frederick Ray I. Gomez;
Page : 5-6
Keywords : Stacked dice; electronic device; semiconductor; process improvement; package design;
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Find it from : Google Scholar
Abstract
Bly of semiconductor electronic devices. This paper presents the advantage of securing a robust design architecture for specailized electronic devices to minimize the potential show stopper in the realization of high-end technology during assembly manufacturing.
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