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Microstructure and Mechanical Behavior of Al-Sb Based Alloys by Rapid Solidification Technology

Journal: International Journal of Mechanical and Production Engineering Research and Development (IJMPERD ) (Vol.10, No. 3)

Publication Date:

Authors : ;

Page : 13707-13720

Keywords : Binary Alsb Melt-Spun Process –Aluminum Antimonide (IMC) – Eutectic Phase – Micro Creep Indentation –Valance Electron Concentration (VEC);

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The study of the effect of antimony (Sb) addition on the mechanical and electrical properties and creep behavior of aluminum (Al) - antimony (Sb) is of great interest. In this work, we shall study the effect of adding a series of the Sb percentage to Al metal matrix composites (MMC) to produce intermetallic compounds (IMC) for the expansion of the solidification and microstructure properties. The additive of 10 and 20 wt% of the Sb element improve the mechanical properties because of grains creep behavior. Sb dispersed between the Al matrix, and the construction of AlSb IMC has to affect mechanical properties such as the stability of elastic moduli average value. Their effect on the behavior of electrical and mechanical properties studied by the temperature dependence of resistivity (TDR) (dynamic- static) method, respectively.

Last modified: 2020-09-30 21:07:52