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EFFECT OF MAGNETIC FIELD INTENSITY ON THE MICROSTRUCTURE AND RESISTIVITY OF ELECTRODEPOSITED NICKEL

Journal: International Journal of Advanced Research in Engineering and Technology (IJARET) (Vol.11, No. 12)

Publication Date:

Authors : ; ;

Page : 335-341

Keywords : Cu/Ni thin film; Electroplating; Magnetic Field; Low-temperature sensor.;

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Abstract

A Cu/Ni thin film has been made using the electroplating assisted by a magnetic field in the direction parallel to the electric field. The magnetic field was varied from 0 to 250 G and then their effect was studied on the thickness of the film, microstructure, and the sheet resistivity. The results show thet, the magnetic field intensity from 0 to 100 G gradually increased the thickness of the Ni film but at 150 G the Ni plating process was inhibited by magnetic driving forces, so the thickness reached the minimum value that was 2.21 µm. Increasing magnetic field intensity up to 150 G increased the ordering of the crystalline structure and reduced the d-spacing between the crystal planes (111). The minimum thickness together with the high ordering of crystalline structure leads to the lowest sheet resistivity that is 2.485 ± 0.287 /sq.

Last modified: 2021-02-23 15:22:46