A COMPARATIVE EXPERIMENTAL STUDY OF HYPOEUTECTIC SN–ZN SOLDER ALLOYS

Low temperature fusing is one of the basic technologies before the achievement of whole lead free transformation in electronics manufacturing. Although Sn-Zn system has good properties such as low temperature solder, it has certain problems such as harm by heat introduction and corrosion by humidity. Zinc has key role in chemical properties. Some of the physical properties, chemical constancies and several reliabilities have been quite comprehend on this alloy system out of the several past works. Low temperature, hypoeutectic Sn-Zn were developed. We tested the nonequilibrium fusion manners of three of Sn–Zn alloys namely (Sn –4.5%Zn, Sn –5.5%Zn and Sn -6.5%Zn) by DTA, at heat rate equal to 5 °C/min, mechanical general properties such as (elongation and ultimate tensile strength (UTS)), Spreading and dipping tests were achived to describe the wettability value of Tin–Zinc alloys system on copper. Both analysis shown that Sn–6.5wt.Zn has considerably superior wettability to copper.