Reinforcing a Bridging Connection Design for Electronic IC Device with Complex Wire Layout Requirement
Journal: International Journal of Scientific Engineering and Science (Vol.3, No. 7)Publication Date: 2019-15-08
Authors : Frederick Ray I. Gomez Rennier S. Rodriguez Nerie R. Gomez;
Page : 28-29
Keywords : Package design; IC; wirebond; bridging connection; wire sweep; electronics.;
Abstract
The integration of bridge connection line on an electronic integrated circuit (IC) package construction is an expansion in the packaging design to improve known assembly limitations particularly on some instances that a long wire connection inside the IC device is inevitable. The technicality of the idea is to replace the identified longest wire connection with an alternative wiring technique and incorporating a conductive interconnects in the device layout where it will be a junction for the wiring of silicon die and input/output (I/O) leads. In this case, the length of the wire can be limited and controlled to a certain distance during IC assembly, that which its behavior on the actual device and assembly can be more predictable and manufacturable
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