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Improved Leadframe Configuration for Warpage Resolution
Journal: International Journal of Scientific Engineering and Science (Vol.3, No. 10)Publication Date: 2019-15-11
Authors : R. Rodriguez F.R. Gomez E. Graycochea Jr.;
Page : 5-6
Keywords : Warpage; QFN; leadframe; die attach process;
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Abstract
A quad flat no-leads (QFN) package in semiconductor manufacturing industry is composed of different direct materials namely leadframe, wire, silicon die, adhesive, and molding compound. One of these materials significantly affect the behavior of the package, particularly the leadframe on warpage issue
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Last modified: 2020-03-18 15:34:36