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Semiconductor QFN IC Package with Refined Leads for Thin Die Applications

Journal: International Research Journal of Advanced Engineering and Science (IRJAES) (Vol.4, No. 2)

Publication Date:

Authors : ;

Page : 91-91

Keywords : Screen printing; glue splattering; refined leads; semiconductor package; thin die; leadframe.;

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Abstract

Contact print is used during screen print process on semiconductor quad flat no-leads (QFN) integrated circuit (IC) leadframe package, wherein adhesive glue is deposited on top of diepad through direct contact between the diepad surface and the stencil

Last modified: 2020-03-20 15:39:32