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Semiconductor QFN IC Package with Refined Leads for Thin Die Applications
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 2)Publication Date: 2019-06-15
Authors : Bryan Christian S. Bacquian Frederick Ray I. Gomez;
Page : 91-91
Keywords : Screen printing; glue splattering; refined leads; semiconductor package; thin die; leadframe.;
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Find it from : Google Scholar
Abstract
Contact print is used during screen print process on semiconductor quad flat no-leads (QFN) integrated circuit (IC) leadframe package, wherein adhesive glue is deposited on top of diepad through direct contact between the diepad surface and the stencil
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Last modified: 2020-03-20 15:39:32