Copper Migration Induces Discoloration on a NiPdAu SurfaceJournal: International Research Journal of Advanced Engineering and Science (IRJAES) (Vol.4, No. 2)
Publication Date: 2019-15-06
Authors : Heidi Rae Valencia Gina Ferreras Ian Harvey Arellano;
Page : 108-111
Keywords : Discoloration; NiPdAu; migration; surface; corrosion.;
Pre-plated NiPdAu surface finish is one of the most common terminal finishing in the semiconductor and electronics industries. The plated surface, usually on top of a copper base material, prevents corrosion and promotes solderability for component attach. Herein, we report the analysis of a discolored NiPdAu surface via scanning electron microscopy – energy dispersive spectroscopy (SEM-EDS), time-of-flight secondary ion mass spectrometry (TOF-SIMS) and X-ray photoelectron spectroscopy (XPS). The surface determinants found in these series of surface analyses indicate the presence of copper, migrating from the unplated pillars of the leads.
Other Latest Articles
Last modified: 2020-03-20 15:47:56