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Copper Migration Induces Discoloration on a NiPdAu Surface

Journal: International Research Journal of Advanced Engineering and Science (IRJAES) (Vol.4, No. 2)

Publication Date:

Authors : ;

Page : 108-111

Keywords : Discoloration; NiPdAu; migration; surface; corrosion.;

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Abstract

Pre-plated NiPdAu surface finish is one of the most common terminal finishing in the semiconductor and electronics industries. The plated surface, usually on top of a copper base material, prevents corrosion and promotes solderability for component attach. Herein, we report the analysis of a discolored NiPdAu surface via scanning electron microscopy – energy dispersive spectroscopy (SEM-EDS), time-of-flight secondary ion mass spectrometry (TOF-SIMS) and X-ray photoelectron spectroscopy (XPS). The surface determinants found in these series of surface analyses indicate the presence of copper, migrating from the unplated pillars of the leads.

Last modified: 2020-03-20 15:47:56