Semiconductor IC Package EMI Shield using Bare Die

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date: 2019-15-07

Authors : Frederick Ray I. Gomez Nerie R. Gomez Rennier S. Rodriguez;

Page : 46-46

Keywords : Critical semiconductor integrated circuits (IC) packages like that of Fig. 1 have signals that are sensitive to electromagnetic interference (EMI); consequently affecting and degrading the functionality of the input/output (I/O) signal;

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Abstract

Critical semiconductor integrated circuits (IC) packages like that of Fig. 1 have signals that are sensitive to electromagnetic interference (EMI), consequently affecting and degrading the functionality of the input/output (I/O) signal

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Semiconductor IC Package EMI Shield using Bare Die

Abstract

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