Quad Flat Package with Embedded ESD Diode on Leads

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date: 2019-15-07

Authors : Frederick Ray I. Gomez Nerie R. Gomez Rennier S. Rodriguez;

Page : 53-53

Keywords : Leadframe; QFP; ESD diode; passive component; semiconductor..;

Source : Download Find it from : Google Scholar

Abstract

As the die technology becomes smaller, faster, and thinner, circuit metallization also becomes smaller, thus the semiconductor device like that of the quad flat package (QFP) shown in Fig. 1 becomes more sensitive and susceptible to electrostatic discharge (ESD) damag

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Quad Flat Package with Embedded ESD Diode on Leads

Abstract

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