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A Practical Study of the Effect of Vacuum Hole Design of Rubbertip in the Manufacturability of Thin Silicon Technology
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Rennier S. Rodriguez Frederick Ray I. Gomez;
Page : 206-207
Keywords : Die bond; rubbertip; die attach; semiconductor; pick and place; process improvemen;
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Abstract
Rubbertip or often called pick-up tool (PUT) in Fig. 1 is a material essential for die attach film (DAF) pick and place process wherein it is used to hold the ejected silicon die from the wafer tapes prior transfer to a carrier substrat
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Last modified: 2020-06-11 19:40:01