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Integration of Mechanical Interlocking Design on Silicon Die

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date:

Authors : ;

Page : 246-246

Keywords : Silicon die; Semiconductor Die; Interlocking; Design Improvements.;

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Abstract

A silicon die or a die is the core of each integrated devices wherein the functional circuit is fabricated. On a Quad flat-no-grid devices, this silicon die is typically glued to the leadframe pad either by conductive or nonconductive paste depending on the thermal and electrical requirements of the device.

Last modified: 2020-06-11 19:47:20