Electronic Package Design with Specialized Marker for Die Placement

Substrate material plays a vital role in electronic packaging industry, as it represents a great portion of the cost and contributes to the overall package performance in terms of electrical and thermomechanical response  Substrate-based packages in Fig. 1 have stack-up made of a dielectric core material, prepreg material, copper traces and vias for the input-output (I/O) signal connections, and protected with top and bottom solder resist material