Die Backside Surface Subtractive Method for Thin Die Application

Advance and Thinner Packages are becoming eminent on the semiconductor field, in order to cater the demanding needs of thinner electronics devices. However, thinner package architectures does possess several assembly problems such as die crack. Die crack is very prone since the wafers are grinded up to thicknesses of 100um and below. Several actions were also present to mitigate this die crack phenomenon. However, the paper discusses subtractive method during wafer preparation process in order to reduce the contact area of the die on the mounting tape, which can cause cracking during die pick up step of die attach process.