Reduction of Silicon Die Tilting Rejection through Indirect Material Enhancement

Bond pick-up tool is the assembly indirect material used to pick and bond the individually sawn die to a carrier material. This indirect material is attached to the bondhead assembly of a diebonder machine wherein it is controlled and supplied with defined pressure during contact to the silicon die. More often, the design and composition of this material is defined during innovation stage since on actual application this is directly correlated to some die attach responses corresponding with wetting and die tilting behaviour of the silicon die to the die attach adhesives. On the other hand, an undefined pick-up tool material during application is found to be the cause of some chronic assembly rejection for integrated circuit device