Integration of Mechanical Interlocking Design on Leadframe-Based Device for Interfacial Strength Improvement

Integration of mechanical inter-locking design for leadframe-based devices is one of the available options to eliminate the delamination occurrence. In this paper, different die pad interlocking design is illustrated and discussed to cater both assembly and reliability requirement. The inter-locking mechanism focus mainly in mechanically improving the tensile and shear characteristic of the glue-leadframe interface. Moreover, the design of the interlock feature could be extended to cover also the moldleadframe interface