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Realization of a Miniaturized BGA Package
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Rennier S. Rodriguez Frederick Ray I. Gomez;
Page : 401-401
Keywords : — BGA; miniaturization; semicondutor; solder balls; substrate technology; die technology;
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Abstract
A ball grid array or BGA semiconductor device is a type of surface mount packaging used in integrated circuit (IC) with the silicon die wired/connected to the bond fingers and metallic inter-layers of the substrate. The inter-layer metallic routing distributes the connection to the defined input/output (I/O) location, as shown in Fig. 1
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Last modified: 2020-06-13 14:46:34