Share Your Research, Maximize Your Social Impacts
Improving the Robustness of a Board-Mounted DFN Package
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jefferson S. Talledo;
Page : 452-452
Keywords : DFN; robustness; board-mounted package; package crack; die pad solder.;
Source : Download
Find it from : Google Scholar
Abstract
A DFN (dual flat no lead) is a leadframe-based package that has metal pads only along the two sides of the bottom surface. As shown in Fig. 1, the metal pads are soldered to the PCB (printed circuit board) to create the required electrical connection.
Other Latest Articles
- Optimization of the Formulation of Antidiabetic Functional Drinks According to Sorghum, Red Ginger, and Aromatic Pandan Leaves in Type II Diabetes Rats
- Evaluative study on tardiness: Lessons for contemporary Muslims
- The migration and historical survey: a reflection on GIDAN Abstract JUMA scholars of ZAZZAU
- Biographical sketch of GIDAN ZAGEZAGI and their contributions to the development of Islam in ZAZZAU
- Contributions of SHAYKH MUHAMMAD MUNTAQA COOMASSIE to the development of Islamic scholarship in ZAZZAU Emirate and beyond (1326/1909C.E-1410/1989C.E.)
Last modified: 2020-06-13 16:13:55