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Using Predictive Modeling Approach in Eliminating Die Crack Induced by Ejector Pin
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 5-5
Keywords : Predictive modeling approach; die crack; ejector pin; die attach; finite element modeling;
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Abstract
During the die attach process in the assembly of a semiconductor package, the die is ejected from an adhesive carrier and picked by a pick and place (PnP) tool's rubber tip as shown in Fig. 1. After being picked up, the die is then attached to a lead frame or laminate substrate.
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Last modified: 2020-06-14 20:26:43