Package Voids Reduction through Effective use of Defect Mapping Analysis in a reel-to-reel Filmassisted Transfer Molding Process

Secure micromodule metal leadframe-based card embedders are widely used for passport and credit card applications. It utilizes film-assisted transfer molding technique as its encapsulation technology. Since the start of early production stage, chronic package void rejects are encountered which accounts as top defect contributor at molding station. This high package voids rejection rate at mold process significantly impacts the assembly yield performance. Hence, it is necessary to reduce or eliminate package voids rejection in order to improve the overall yield. This technical paper discusses the various DMAIC tools and methodology, including the use of comprehensive defect mapping analysis which was remarkably beneficial in eventually identifying a mold tool design limitation. Inevitably, mold tool design modification was performed to significantly reduce the package voids defect thus helped improve the overall yield for secure micromodule produc