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Mechanical Interlocking Integration for Lead to Mold Interfacial Strength Improvement
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Rennier S. Rodriguez;
Page : 10-10
Keywords : QFN; Package Reliability; Delamination; Mechanical Interlocking.;
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Abstract
Package reliability measures the manufacturing consistency and quality for an individual integrated circuit device. A QFN (Quad Flat No-Lead) device may composed of different direct material (leadframe, silicon die, wire, adhesives, molding compound) types and architecture creating dissimilar reliability result for each individual combination.
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Last modified: 2020-06-14 20:29:27