Die Attach Epoxy Break Tail Parameter Optimization

Die attach, also known as die bonding, is the process of attaching (or bonding) a die (or chip) to a substrate, leadframe or another die. This process can take on many forms and can be applied in many different ways. The common die attach material is Epoxy. Epoxy Dispensed through dispensing needle or nozzle by controlled volume on the substrate. The location of the dispensing is controlled with vision control system in the die attach equipment a