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Establishing a Reliable Model for Breaking Load Prediction of a Very Thin Package

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)

Publication Date:

Authors : ;

Page : 52-54

Keywords : Package breaking load; bend test; thin package; package crack; finite element modeling.;

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Abstract

As semiconductor package becomes thinner, determining the force that can be applied to the package without causing package crack becomes very important.  Package 3-point bend test is usually done to determine the package breaking load as shown in Fig. 1.  However, the package bend test could only be done after the package is manufactured or assembled

Last modified: 2020-06-14 20:41:11