Establishing a Reliable Model for Breaking Load Prediction of a Very Thin Package
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 52-54
Keywords : Package breaking load; bend test; thin package; package crack; finite element modeling.;
Abstract
As semiconductor package becomes thinner, determining the force that can be applied to the package without causing package crack becomes very important. Package 3-point bend test is usually done to determine the package breaking load as shown in Fig. 1. However, the package bend test could only be done after the package is manufactured or assembled
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Last modified: 2020-06-14 20:41:11