Substrate Design Augmentation to Address Wire to Solder Mask Shorting

Recently, new technologies in semiconductor electronics industry are getting augmented and one of the challenges is the design of the material to be used. The product in focus on this paper is one of the major products in the market as it used on wide range of applications such as smartphones, security devices and automated teller machine (ATM) cards. Fig.1 shows the assembly manufacturing process flow of the product with the wirebonding process as the most challenging task