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Understanding the Strip Warpage Failure Mechanism After Die Attach Cure
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 73-75
Keywords : Strip warpage; die attach cure; warpage modeling; warpage failure mechanism.;
Source : Download Find it from : Google Scholar
Abstract
With the need to use thinner laminate substrates and thinner dies, package assembly becomes very challenging.
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Last modified: 2020-06-14 20:45:46