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Modeling Study on Die-to-Pad Ratio and Its Relationship with QFN Delamination
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 70-72
Keywords : Die-to-pad ratio; QFN delamination; die pad; interface stress; package crack; finite element modeling;
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Abstract
The continuing trend in IC (integrated circuit) packaging is miniaturization or package size reduction. However, there is also a need to increase die functionality and a larger die is being forced to fit in a smaller die pad and this results in higher die-to-pad ratio for QFN (quad flat no lead) package
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Last modified: 2020-06-14 20:45:06