Enhanced Tape and Reel Spacer to Eliminate Depressed Wire for Micromodule Packages

Micro module packages are normally with tape and reel process in semiconductor manufacturing industry. This thin package comes with a tape carrier wherein silicon die was attached and a yellow spacer is placed to support the tape in winding the whole sub lot. During the qualification stage of this package, one major issue encounter is depressed wire at the output reel. Figure 1 shows the assembly process flow of the package and wire bond is the critical process wherein the problem occurred was highlighted in red box.