Modified Indexer Top Plate for Micrmodule thin Packages

Introduction of technology innovation in semiconductor industry are getting more complex in terms of materials, designs, processes and other factors that can cause issues. One major challenge in die attach is the design of the indexer top plate. This indexer top plate used to hold the tape during processing. This product application puts on smartphones, security devices and automated teller machine (ATM) cards. Fig. 1 shows the assembly process flow of the product and as high lightened by a red dotted line below is the process where the issue occur.