Predicting the Final Shape of Free Air Ball (FAB) in Semiconductor Package Wire Bonding

Wire bonding is a very popular method of interconnection used in semiconductor packages.  The wire (e.g. gold, copper, silver) provides electrical connection between the integrated circuit (IC) die to the package lead or terminal as shown in Fig. 1.  A bonding capillary of wire bonding machine is used to bond the electrically-conductive wire to the IC die bond pad by forming a free air ball (FAB) fi