A Modeling Study on the Relationship between Silicon Die Crack and Tacky Die Attach Film

In the die attach process of a semiconductor package assembly manufacturing, a pick and place (PnP) vacuum rubber tip picks the die having die attach film (DAF) from the wafer mounting tape as illustrated in Fig. 1 before attaching the die to the substrate or leadframe.  During pickup, there is adhesion between DAF and the mounting tape that must be overcome so the die and DAF will be completely separated from the mounting tape to have successful picking up of the die