Incorporating a Metallized Die for Stable Wirebonding Configuration

Wirebonding is a process under integrated circuit assembly responsible in attaching a semiconductor wire from the bond pads of the silicon die to the metal pads of the carrier.  This process uses thermo-compression method to form the inter-metallic layer between metals, wire-bond pads and wire-metal pads.  Metals such as gold, silver, copper and aluminum are the most common material used for wirebonding.