Printed SMT Design for Alternative Packaging Technology
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Rennier S. Rodriguez;
Page : 132-132
Keywords : ;
Abstract
The direction for thinner and densified version of Quad Flat No-lead (QFN) device benefits thermal performance and increased in number of I/O respectively. QFN is one form of Surface Mount Technology (SMT) composed of a silicon die bonded to a lead through wire. The overall unit is encapsulated by a molding compound material to protect the active circuit of the unit.
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Last modified: 2020-06-14 21:04:05