ResearchBib Share Your Research, Maximize Your Social Impacts
Sign for Notice Everyday Sign up >> Login

Printed SMT Design for Alternative Packaging Technology

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)

Publication Date:

Authors : ;

Page : 132-132

Keywords : ;

Source : Downloadexternal Find it from : Google Scholarexternal

Abstract

The direction for thinner and densified version of Quad Flat No-lead (QFN) device benefits thermal performance and increased in number of I/O respectively.  QFN is one form of Surface Mount Technology (SMT) composed of a silicon die bonded to a lead through wire.  The overall unit is encapsulated by a molding compound material to protect the active circuit of the unit.

Last modified: 2020-06-14 21:04:05