Enhancement of Multiple Fiducial Reference for Strip Warpage to Prevent Mis-align Cut at Package Singulation

Package sawing process in semiconductor assembly manufacturing is a process typically performed to separate integrated circuit packages such as IC chips from a substrate / leadframe in order to form the individual units.  Two (2) types of package singulation already available in the manufacturing industry today. Jig sawing which uses rubber jig plus vacuum and Tape sawing process which uses UV tape.  Different materials such as Lead frame base package and substrates base package modules are prone to warpage which induced by residual stresses during moulding process and by subjecting to different temperature afterwards.  Complicated packages today such as partial package sawing of products must require high tolerances of kerf-width to protect from any possible mis-align cut defect that will be encountered during partial package and full package sawing proces