Analyzing the DAF Voids due to Die Warpage for Thin Die

The objective of this study is to develop a robust die attach process and tooling design using adhesive material of DAF after studying the material characteristics and knowing the effects of each important property relating to the performance of reliability of package. The result of Die Attach tooling selection shows that design Nozzle Type Rubber tip shank prevents die warpage problem and eliminate the delamination or DAF voids