STRUCTURE AND RESISTIVITY OF CU/NI THIN FILM –EFFECTS OF ELECTROPLATING ASSISTED WITH PARALLEL MAGNETIC FIELD ON DEPOSITION TIME VARIATION

Cu/Ni thin film has been made with an electroplating method assisted with a parallel magnetic field on deposition time variation. The purpose of this research is to find out the thickness, microstructure, and resistivity of Cu/Ni thin film. The electroplating process was carried out with a magnetic field of 150 G, a solution temperature of 60°C, and an electrode distance of 4 cm. The solution used was made from the mixture of H3BO3 40 gram, NiSO4 260 gram, NiCl2 60 gram, and H2O 1000 ml. The deposition time was varied from 60 s to 540 s. Deposition time has a positive influence on the thickness of the film, which is the longer deposition time the thicker Ni film. Deposition time also influences the microstructure parameter of Ni film. The Ni [111] diffraction peak is at an angle of approximately 44.8°. The intensity of the diffraction peak has an upward trend from the time of 60 s to 320 s and then it has a downward trend. Meanwhile, the profile of the grain size curve is similar to the distance of crystal plane which is from 60 s to 120s it goes down, then from 120 s to 420 s it goes up and then goes down again. However, the sheet resistivity has an upward trend towards deposition time.