AlN thin Film Coated Cu Substrates as Heat Sink for High Power LED Applications

Heat generates from power electronics must be dissipated to maintain operating temperatures within specification. Thermal management is an important design consideration in which thermal interface material (TIM) plays important role on reducing the thermal resistance between hot and cold points. AlN thin film and AlN/Al stack were used as TIM and Cu substrates was used as heat sink. The observed total thermal resistance (Rth-tot) was low for AlN thin film coated Cu substrate. Noticeable decrease in junction temperature (TJ) rise (?TJ = 6 °C) was recorded for the LED using AlN thin film as TIM. AlN and AlN/Al thin film stack were not supported to enhance the luminosity of the given 3W LED but driving current influenced on optical properties noticeably.