Design and Analysis of Temperature Sensor Array by Using Comsol Multiphysics 4.3

This paper propose a new design and analysis of MEMS sensor array based on thermal stress and electric current properties. The COMSOL Multiphysics 4.3 software is used to design the sensor array of the sensing layer. The material selection is done based on the thermal analysis of the sensor array. The polysilicon yield a maximum displacement of 0.00143μm and also it is suitable for human skin. So polysilicon can be proposed for sensor array and then analysis the performance of sensor array.