ResearchBib Share Your Research, Maximize Your Social Impacts
Sign for Notice Everyday Sign up >> Login

Stress Transmission During Punching Operation of a Smart Card Module

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date:

Authors : ;

Page : 402-402

Keywords : smartcard module; punching; stress transmission; die crack; resin crack;

Source : Downloadexternal Find it from : Google Scholarexternal

Abstract

A smart card module considered here has a flexible leadframe in continuous reel format.  Punching is needed to isolate distinct contact areas as shown in Fig. 1

Last modified: 2020-06-13 14:47:20