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Stress Transmission During Punching Operation of a Smart Card Module
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jefferson S. Talledo;
Page : 402-402
Keywords : smartcard module; punching; stress transmission; die crack; resin crack;
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Abstract
A smart card module considered here has a flexible leadframe in continuous reel format. Punching is needed to isolate distinct contact areas as shown in Fig. 1
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Last modified: 2020-06-13 14:47:20