A System Improvement to Control the Die Attach Materials

With the fast moving technology that requires Automation, in order to achieve company goal of Industry 4.0, our manufacturing systems should be able to surpass Industry 3.0, where automation and computer aided techniques are essential. This paper discusses the implementation of Die Attach Material Control which leads to the development of a new system that will provide computerized traceability and at the same time incorporate engineering process controls Error Proof system (pokayoke) to become one of the most effective tools in the electronics manufacturing industry. This addresses the common system's lack of controls, incomplete data and manual retrieval of records linked to human intervention. That can prevent to misprocess due to Expired & Wrong Material for the manufacturing perishable material. As highlighted, the focus is the assembly process step at Die attach operations, showed in figure1. During this process, singulated silicon dies are picked from incoming tested wafers and placed on a Leadframe carrier or strip with applied die attach material or epoxy.