Die Attach Pre-bond Optimization for NickelPalladium-Gold Roughened Leadframe

Today, we mainly use plated leadframes. Plated leadframes can help improve adhesion of the die attach, wire bonds, and mold compound, and improve the solderability of the leadframe. Other technique to improve adhesion is to change the plating finish. One can roughen the nickel layer through a chemical etch before depositing the palladium. Figure 1 (below) shows an example of a Roughened Ni/Pd/Au preplated leadframe