Enhanced cDAF Material: A Process Improvement for Die Attach focusing on Die Shear Strength

New material technologies like conductive die attach film were introduced in order to cater packages with high thermal and electrical requirements. However, these materials creates several problems during its manufacturing assembly. Conductive Die Attach film needs a good adhesion from the die backside and the carrier die paddle to ensure good electrical conduction. The paper discusses the improvement done on the material in order to increase its adhesion strength.