Improved cDAF for Reducing Adhesive Film Remains in Die Attach Pick-up Process

Nowadays, new technologies are getting augmented and improved in the semiconductor industry, and one of which is the development in die attach materials particularly the conductive die attach film material. Conductive die attach film, also known as cDAF, is mounted below the silicon die and is also used to connect into the circuit boards. However, this technology contributes numerous problems during development stage of the semiconductor package. Fig. 1 shows the standard assembly process flow with the concerned process at the die attach station. During die attach pick-up process of the silicon die, the requirement is that there must be no adhesive film remains in the wafer tape to get a good adhesion during die bonding into the semiconductor carrier, for this case the leadframe, and to also have a good reliability response