Realization of Wettable Sidewall for Quad Flat NoLead Devices
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Rennier S. Rodriguez Ian Harvey Arellano;
Page : 463-465
Keywords : Silicon die; Semiconductor Die; Wettable flank; Design Improvements.;
Abstract
Incorporating a wettable sidewall in quad flat no-lead devices is one the new requirement of automotive customers to improve its performance in board level application. An alternative solution is through leadframe design modification in conjunction with optimizing the singulation and the plating processes to create a quad flat no-lead (QFN) device exhibiting good wettability at the lead sidewall
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