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Leadframe Paddle Enhancement for DelaminationFree Packaging
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Edwin Graycochea Jr. Bryan Christian S. Bacquian;
Page : 477-477
Keywords : Silicon die; Semiconductor Die; Interface; Design Improvements; Delamination;
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Abstract
A QFN-mr (Quad Flat No-grid Multi-row) is a type of packaging technique under surface mount devices wherein it is capable of higher number of I/O (Input/Output) count than conventional QFN devices. The technology uses leadframe as carrier for the silicon die with an encapsulation material of epoxy mold compound to conceal the wiring and functional circuitry of the die.
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Last modified: 2020-06-13 16:28:48